| Product: | Rotary Switch |
| Manufacturer: | Nidec Copal |
| Features: | 1. Optimum for high density board mounting applications |
| 2. Compatible with most automatic pick & place machinery | |
| 3. Protection against dust and washable after soldering | |
| 4. Top and side setting types are available | |
| 5. Same dimensions as ST-32 trimmer and conveniently usable as a set |
Contact
| Specifications | |
| Packaging method: | Tape&Reel, Pack |
| Installation type: | SMD, SMD right angle |
| Operating temp: | -40℃ ~ 85℃ |
| Ampacity: | Contact rating 0.5 VA Maximum current 100 mA |
| Rated voltage: | Contact rating 0.5 VA Maximum voltage 16 V |
| Size (mm) (L*W*H): |
3.4x3.4x2 |
| note | For further information, please contact:+886-3-4266335 |
ELECTRICAL CHARACTERISTICS
| Contact timing: | Non-shorting |
|---|---|
| Contact resistance: | 2 MΩ max. |
| Insulation resistance: | 100 MΩ (DC500 V) min. |
| Dielectric strength: | AC250 V, 60 s |
MECHANICAL CHARACTERISTICS
| Stopper strength: | 20 mN·m {204 gf·cm} minimum |
|---|---|
| No. of positions: | 2 |
| Adjustment torque: | 5 mN·m {51 gf·cm} maximum |
| Stepping angle: | 250° ± 15° |
| Solderability: | Sn-Cu (lead-free)：245 ± 3 °C, 2 ~ 3 s |
| Soldering heat: | Sn-Cu (Lead-free) Flow : 260 ± 3 °C as the temperature in a pot of molten solder, immer sion from head of terminal to backside of board, 5 ~ 6 s, two times maximum. Reflow : Peak temperature 255 °C (Please refer to the profile below.) Manual soldering : 350 ± 10 °C, 3 ~ 4 s |
| Shear (Adhesion): | 5 N {0.51 kgf}, 10 s |
| Substrate bending: | Width 90 mm, bend 3 mm, 5 s, 1 time |
| Pull-off strength: | 5 N {0.51 kgf}, 10 s |
ENVIRONMENTAL CHARACTERISTICS
| Load life: | 50 cycles minimum DC16 V 30 mA |
|---|---|
| Vibration: | Amplitude 1.5 mm or Acceleration 98 m/s2,10-500-10 Hz, 3 directions for 3 times each |
| Shock: | 490 m/s2, 11 ms 6 directions for 3 times each |
| Humidity (Steady state): | 40 °C, Relative humidity 90 ~ 95 %, 240 h |
| High temperature exposure: | 85 °C, 96 h |
| Low temperature exposure: | −40 °C, 96 h |
| Thermal shock: | −40 (0.5 h) ~ 85 °C (0.5 h), 5 cycles |
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