Product: DIP Switch
Manufacturer:  Nidec Copal
Features: 1. Small size of 4.8 mm makes it perfect for high density board mounting applications
  2. Gold plated contact provides excellent reliability
  3. Low profile design of 2.6 mm
  4. RoHS compliant

Contact
Specifications
Packaging method: Tape&Reel, Pack
Installation type: Surface mount type
Operating temp: -20℃ ~ 70℃
Ampacity: Non-switching: 100 mA
Switching:100 mA
Rated voltage: Non-switching: DC50 V 
Switching:DC2.4 V 
Size (mm)
(L*W*H):
4.8X4.8X2.6
note For further information, please contact:+886-3-4266335



Electrical Characteristics

Contact resistance: 100 mΩ maximum
Insulation resistance: 100 MΩ (DC100 V) minimum
Dielectric strength: AC250 V, 60 s

Mechanical Characteristics

No. of positions: 10
Adjustment torque: 10 mN·m {102 gf·cm} maximum
Stepping angle: 36° (10 positions)
Solderability: 245 ± 3 °C, 2 ~ 3 s
Soldering heat: Reflow:255 °C (Peak temperature)
Manual soldering:350 ± 10 °C, 3 ~ 4 s
Shear (adhesion): 5 N {0.51 kgf} 10 s
Substrate bending: Width 90 mm, bend 3 mm, 5 s, 1 time
Pull-off strength: 5 N {0.51 kgf} 10 s

Environmental Characteristics

Vibration: (Amplitude)1.5 mmor (Acceleration) 98 m/s2, 10-500-10 Hz, 3 directions for 2 h each
Shock: 490 m/s , 11 ms 6 directions for 3 times each
Load life: 10000 steps minimum DC2.4 V 100 mA
Humidity (Steady state): 40 °C, Relative humidity 90 ~ 95 %,240 h
High temperature exposure: 70 °C, 96 h
Low temperature exposure: − 25 °C, 96 h
Thermal shock: − 25 (0.5 h) ~ 70 °C ( 0.5 h ), 5 cycles

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